Lead Full Stack Engineer guiding .NET and Vue/React development for CoverGo’s global digital insurance SaaS platform. Leading architecture, performance, security, and engineering teams.
About the role
- Principal Engineer leading design and electrical characterization of high-speed IC packages for Semtech's Datacenter connectivity products. Collaborating across teams to ensure quality and reliability in high-volume production.
Responsibilities
- Lead the design and electrical characterization of advanced high-speed IC packages
- Perform 3D signal integrity modeling and experimental validations
- Prepare technical reports and application notes for internal and external stakeholders
- Design PCB and high-density substrate layouts
- Serve as the technical interface with manufacturing suppliers
- Identify and launch projects with strategic suppliers to advance the packaging roadmap
- Mentor junior packaging engineers and contribute to the improvement of design methodologies
Requirements
- Bachelor's degree in Electrical Engineering, Physics Engineering, or a related field
- 8+ years of experience as an IC Package Design Engineer or Signal Integrity Engineer
- Deep expertise in high-speed transmission line theory
- Hands-on proficiency with industry-standard EDA tools: Keysight ADS, Cadence APD/SiP, Ansys HFSS
- Demonstrated experience with RF/SI measurement equipment including VNA and TDR
- Familiarity with multiple advanced packaging technologies: 2D, 2.5D, 3D, Fan-In, Fan-Out, high-density substrate, silicon bridge interconnects, COB
- Experience in optoelectronics package design or opto-electronic assembly is a strong asset
- Working knowledge of JEDEC specification JESD47H and its design implications
- Proven ability to manage supplier relationships throughout NPI phases
Benefits
- competitive compensation and benefits package
- equity participation
- support for professional and personal growth
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