About the role

Optical Packaging Engineer developing scalable alignment and assembly processes for Photonic’s integrated quantum circuits. Optimizing manufacturing workflows, data-driven yields, and product qualification.

Responsibilities

Develop and implement optical packaging and assembly processes for integrated photonic devices, including high-precision active alignment to achieve optimal coupling efficiency and long-term stability
Design, validate, and optimize alignment methods and tooling to improve accuracy, throughput, and repeatability
Establish validation plans and characterize optical performance under relevant operating conditions
Define scalable workflows, SOPs, and process controls to ensure consistent manufacturing outcomes
Support New Product Introduction by partnering with design, device, test, and manufacturing teams to apply Design for Excellence methodologies, including Design for Manufacturability, Design for Test, and Design for Reliability
Develop assembly stations integrating precision motion, optical metrology, and environmental control
Analyze assembly, process, and test data to identify yield drivers, root causes, failure mechanisms, and opportunities for improved throughput, repeatability, and stability
Collaborate across teams to develop robust, manufacturable packaging solutions
Define qualification criteria and acceptance standards to support product release

PhD or Master’s degree in physics, applied physics, packaging engineering, electrical engineering, or other relevant discipline
Knowledge of and hands-on-experience with integrated photonics and optics
3+ years of experience with photonic integrated circuit, semiconductor, optoelectronic, fiber optic, or related packaging design & qualification
Working experience in new product introduction
Excellent teamwork, interpersonal and written communication skills
Good organization and problem solving skills
Strong attention to detail
Deep hands-on expertise in high-precision optical alignment and packaging for Photonic Integrated Circuits
Proven ability to translate research-grade photonic assemblies into robust, production-ready assembly processes
Strong experience in data-driven process optimization including analyzing large datasets to identify yield drivers, diagnose failure mechanisms, and improve process stability
Demonstrated contribution to New Product Introduction (NPI) and experience in Design for Excellence (DfX) methodologies with focus on Design for Manufacturability (DfM), Design for Test (DfT), and Design for Reliability (DfR)
Cover letter with resume in one file

Work closely with some of the brightest innovators in quantum technologies to drive breakthroughs that redefine computing
Enjoy a fast-paced and fun environment where you can try new things while solving innovative challenges every day
Inclusive company culture that values collaboration
Regular social events and fun activities keep our global team connected
Competitive compensation package including stock options and relocation assistance for global talent
Comprehensive benefits including extended health, dental, life, long term disability, an employee assistance program, parental leave top-ups, and a flexible spending account
Full time roles are eligible for equity and benefits