Principal Applied AI Developer creating scalable ML infrastructure for Autodesk. Leading complex initiatives and defining technical strategy for AI capabilities.
About the role
- Platform Architect leading design and optimization of AI infrastructure platforms. Focused on thermal management for cooling solutions in AI datacenters.
Responsibilities
- Define end-to-end thermal architecture strategies for GPU servers, optical interconnects, and CPO-based systems
- Develop system-level approaches to balance performance, heat dissipation, reliability, and energy efficiency
- Design and optimize solutions for: High-power GPUs and accelerators, Dense optical I/O (pluggable and co-packaged optics), Rack- and cluster-level thermal constraints
- Optimize cooling strategies for high-density AI workloads and optical bandwidth scaling
- Analyze and improve thermal resistance, junction temperatures, and cooling efficiency
- Lead design and evaluation of advanced cooling approaches, including: Air cooling (high-performance heatsinks, airflow optimization), Liquid cooling (direct-to-chip, cold plates), Immersion cooling and emerging techniques
- Architect thermal solutions for: High-speed optical transceivers (400G/800G/1.6T+), Co-packaged optics (CPO) integrated with switch or GPU ASICs
- Collaborate with silicon photonics teams to co-design thermal-aware optical packaging architectures
- Design GPU server platforms optimized for thermal efficiency, including: Multi-GPU configurations and interconnect density, Power delivery and cooling integration, Airflow and liquid loop design
- Drive innovations in rack-level and data center-level cooling, including: High-density rack (>50–100kW) thermal strategies, Integration with facility cooling systems, Optimization for power usage effectiveness (PUE)
Requirements
- Required Bachelor’s or Master’s degree in Mechanical Engineering, Electrical Engineering, Physics, or related field
- 8–12+ years of experience in system architecture, thermal engineering, or hardware platform design
- Deep expertise in: Thermal management and cooling technologies for high-performance systems, GPU servers, AI/HPC infrastructure, or data center platforms, Optical interconnects and high-speed systems (1.6T+)
- Strong understanding of: Heat transfer (conduction, convection, liquid cooling systems), Power density and thermal constraints in modern compute systems, Tradeoffs across performance, cooling, cost, and reliability
- Preferred Experience working with hyperscalers or large-scale AI deployments
- Experience with co-packaged optics (CPO) and silicon photonics thermal challenges
- Hands-on design experience with: Liquid cooling systems and cold plate design, High-density rack and cluster cooling
- Knowledge of: Optical module thermal constraints and reliability, Data center infrastructure (HVAC, liquid loops, facility integration)
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